MediaTek revealed its latest 8000-series chipset with the Dimensity 8300. The new chip is made using the latest technology from TSMC, which is really advanced. It’s the next version after last year’s Dimensity 8200, and it’s better in every way, giving you improved performance.
The Dimensity 8300 has a powerful setup with four high-performance cores that can run as fast as 3.35GHz and four efficiency cores that can run at speeds of up to 2.2GHz. These eight cores use the latest Armv9 CPU architecture. According to MediaTek, the CPU performance is claimed to be up to 20% faster, and there’s a 30% improvement in power efficiency compared to the previous Dimensity 8200.
| Dimensity 8300 | Dimensity 8200 | Dimensity 8100 | |
| Node | 4 nm | 4 nm | 5 nm |
| CPU Prime | 1x Cortex-A715 @ 3.35 GHz | 1x Cortex-A78 @ 3.1 GHz | – |
| CPU Big | 3x Cortex-A715 @ 3.0 GHz | 3x Cortex-A78 @ 3.0 GHz | 4x Cortex-A78 @ 2.85 GHz |
| CPU Little | 4x Cortex-A510 @ 2.2 GHz | 4x Cortex-A55 @ 2.0 GHz | 4x Cortex-A55 @ 2.0 GHz |
| RAM | LPDDR5X (up to 8,533Mbps) | LPDDR5 (up to 6,400 Mbps) | LPDDR5 (up to 6,400 Mbps) |
| Storage | UFS 4.0 with MCQ | UFS 3.1 | UFS 3.1 |
| GPU | Mali-G615 (60% faster than 8200) | Mali-G610 MC6 | Mali-G610 MC6 |
| Display | FHD+ @ 180Hz, WQHD+ @ 120Hz | FHD+ @ 168 Hz, WQHD+ @ 120 Hz | FHD+ @ 180Hz, WQHD+ @ 120Hz |
| Camera (stills) | 320 MP | 320 MP | 200 MP |
| Camera (video) | 4K @ 60 fps (HDR10+) | 4K @ 60 fps (HDR10+) | 4K @ 60 fps (HDR10+) |
| 5G | 5.17 Gbps downlink | 4.7 Gbps downlink | 4.7 Gbps downlink |
| Wi-Fi | Wi-Fi 6E (2×2) | Wi-Fi 6E (2×2) | Wi-Fi 6E (2×2) |
| Bluetooth | 5.4 | 5.3 | 5.3 |
The latest chip has a new Arm Mali-G615 MC6 GPU, which makes things run up to 60% faster and uses 55% less power when working at full speed than the previous version. MediaTek, the company behind the chip, also says it can launch apps 17% faster when you open them for the first time and 47% faster when you open them from standby. This new chip can work with a type of fast RAM called Quad-channel LPDDR5X, running at 8,533Mbps, and it supports UFS 4.0 storage, which is also speedy and includes a feature called Multi-Circular Queue (MCQ).
The APU 780 inside Dimensity 8300 makes it the first chip in its class to support Generative AI with stable diffusion and support for LLM with up to 10 billion parameters. The Imagiq 980 ISP supports up to 320MP camera sensors and 4K video recording at 60fps.
The Dimensity 8300 comes with built-in 5G capabilities that support both types of 5G networks. It can achieve download speeds of up to 5.17 gigabits per second on sub-6GHz networks. Additionally, the chip has Wi-Fi 6E and Bluetooth 5.4 for fast and reliable wireless connections.
Xiaomi already confirmed that its Redmi K70E will debut the Dimensity 8300 later this month.
